OREM, Utah — August 2025 — Coreform is pleased to announce its participation as a Gold Sponsor of the upcoming 44th Annual Tire Society Conference, which will be held September 23–25, 2025, at the University of Akron in Ohio.
The Tire Society Conference is a premier international event for tire science and technology, bringing together leading researchers, engineers, and industry experts to exchange ideas, present the latest advances, and shape the future of the field. Each year, the conference highlights groundbreaking developments across design, materials, simulation, and sustainability—critical areas of innovation for the global tire industry.
As a Gold Sponsor, Coreform is proud to support this vibrant technical community. Coreform Cubit, our advanced hex meshing software, continues to play an important role in enabling accurate simulations for automotive and tire engineering, helping researchers and companies reduce development time and achieve more reliable results. Coreform’s next-generation isogeometric analysis technology, Coreform Flex, offers the possibility of simulating the most complex tire tread without any manual meshing.
Coreform’s team will be on site and looks forward to meeting attendees, learning about their projects, and discussing how next-generation meshing technology can accelerate tire research and development. Those interested in scheduling a meeting with Coreform during the conference are encouraged to contact sales@coreform.com.
More information about the conference program and registration is available on the Tire Society’s website: Tire Society 44th Annual Conference.